The precision semiconductor wafer ultrasonic cleaning system is specifically designed to meet the extreme cleanliness requirements of advanced processes. The equipment utilizes high-frequency ultrasonic cavitation technology (adjustable from 1 to 3 MHz) in conjunction with chemical processes to efficiently remove sub-micron particles, organic residues, and metal ions from the wafer surface, and is compatible with 8-12 inch wafers. Its innovative multi-mode cleaning architecture supports flexible combinations of ultrasonic and two-fluid cleaning, achieving a wafer surface cleanliness qualification rate close to 100%.

The equipment features fully automatic loading and unloading, with automatic switching between loading, ultrasonic cleaning, drying, two-fluid cleaning, and unloading processes, reducing the cleaning cycle by 30% and saving three workers. It has successfully passed trials at industry leaders such as Texas Instruments (TI) and received repeat orders.